PCB 101
Learn the ABCs of making Printed Circuit Boards. Take an in-depth pictorial tour through the manufacturing process and learn what drives cost and manufacturability.
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PCB 102 - Rigid Flex
Learn what is involved in fabricating a Rigid-Flex PCB. This includes a pictorial tour of the manufacturing process and an in depth look at what drives cost and manufacturability. Rigid flex PCBs are becoming a mainstream interconnection option. Learn how this technology can solve interconnection challenges effectively in terms of cost and functionality.
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HDI & Microvias
This comprehensive seminar offers a look at the world of HDI & microvia technology. Learn how to utilize more effectively this technology. This seminar includes design constraints, stackup options, cost drivers and DFM considerations.
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Impedance Control
This seminar looks at the different structures and their uses. Also included are design for manufacturability and PCB layout concerns. What affects impedance? Learn about different impedance stickups and applications.
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Surface Finishes
Confused about surface finishes? Where is the industry heading? All the pros and cons of the optional finishes are investigated.
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Advanced Materials for RF Applications
Topics include material selection, electrical and mechanical characteristics, manufacturability, surface finishes and cost drivers.
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Current-Carrying Capacity
Learn how the board material, thickness, electrical current, and internal copper effect the temperature of an electrical conductor. This seminar is the product of three years of testing, computer modeling and research.
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Advanced Thermal Management
Turn your PWB into an advanced thermally managed solution. Learn the difference between an Insulated Metal PCB and an Integrated Thermal Solutions PCB.
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Embedded Passives
The future is embedding passive components; freeing up valuable real estate on the outer surfaces, and increasing performance and functionality.
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Buried Planer Capacitance (BC-2000)
Find out how to remove up to 40% of your discrete capacitors, reduce costs and circuit size.
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RoHS and Lead Free
A focus on how lead free initiatives impact the PWB materials and processes. This seminar gives the PCB fabricators perspective. Coretec's RoHS compliance program and documentation are industry leading.
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CAF
Understand what Conductive Anodic Filament (CAF) growth is. Examine the history and concerns as well as looking at design related issues.
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Design
Understand the various elements required to produce a comprehensive design package and how Coretec can exceed all your design requirements.
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Via and Hole fill
Understand the different options available for both conductive and non-conductive Hole Fill. This seminar also covers Design Rules, Cost Constraints and Manufacturability associated with using each of the different materials currently available.
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