|
Standard Features
|
Standard Capabilities
|
Leading Edge
|
|
| I/L trace/space |
.004/.004 [100/100]
|
.003/.003 [75/75]
|
**1
|
| E/L trace/space |
.004/.005 [100/125] |
.003/.003 [75/75] |
|
|
Pad over drill size for tangency |
0.010
[250] |
0.008
[200] |
|
|
Antipad over drill |
0.020
[500] |
0.016
[400] |
**2 |
|
Minimum mechanical drill size |
0.008
[200] |
0.006 [150]
|
**3 |
|
Minimum core thickness |
0.002
[50] |
0.001
[25] |
|
|
Maximum copper weight |
3 oz
[105] |
6 oz
[210] |
|
|
Minimum copper weight |
1/2 oz
[25] |
1/8 oz
[5] |
|
|
Maximum aspect ratio |
10:1 |
12:1 |
|
|
Maximum layer count |
30+ |
30+ |
|
|
Maximum board thickness |
0.250 [6.25] |
0.450 [11.25] |
**4 |
|
Minimum board thickness |
0.021 [525] |
0.008 [200] |
|
|
Solder mask registration |
± 0.002
[50] |
± 0.0015
[37.5] |
|
| |
|
|
|
| |
|
|
|
|
Micro Via Features |
|
|
|
|
Minimum micro via hole size |
0.004
[100] |
0.003
[75] |
|
|
Maximum aspect ratio |
.7:1 |
1:1 |
|
|
Capture/target pad over drill size |
0.008
[200] |
0.006
[150] |
|
|
Micro via copper hole plug |
Y |
Y |
|
|
Glass reinforced dielectrics [UV/CO2 dual laser] |
Y |
Y |
|
| |
|
|
|
| |
|
|
|
|
Materials |
|
|
|
|
FR-4
(minimum 170Tg (DSC)) standard |
Y |
Y |
|
|
Polyimide |
Y |
Y |
|
|
Getek/Megatron
(PPO) |
Y |
Y |
|
|
Isola
(all except 640 series and IS500) |
Y |
Y |
|
| Isola
(IS640, IS500) |
N |
Y |
|
| BC2000 |
Y |
Y |
|
|
Rogers
(4000 series) |
Y |
Y |
|
|
Rogers
(3000, 5000, 6000, TMM series) |
N |
Y |
|
|
Arlon |
N |
Y |
|
|
Nelco
(4000, 5000, 7000, 8000, 9000 series) |
N |
Y |
|
|
Thermagon
|
Y |
Y |
|
|
Gore
(Speedboard C, Speedboard N) |
N |
Y |
|
|
Thermount |
N |
Y |
|
|
Bromine free |
N |
Y |
|
|
Taconics |
N |
Y |
|
| |
|
|
|
| |
|
|
|
|
Surface Finishes |
|
|
|
|
Hot air solder level |
Y |
Y |
|
|
Electroless nickel immersion gold |
Y |
Y |
|
|
Electrolytic nickel/gold |
Y |
Y |
|
|
Immersion tin |
Y |
Y |
|
|
Immersion silver |
Y |
Y |
|
|
Selective finishes |
N |
Y |
**5 |
|
Wire bondable soft electrolytic gold |
Y |
Y |
|
|
Tin-lead reflow |
N |
Y |
**6 |
|
Organic solderability preservative |
Y |
Y |
|
| |
|
|
|
| |
|
|
|
|
Other |
|
|
|
|
Buried core vias |
Y |
Y |
|
|
Sequential lamination |
Y |
Y |
|
|
Optical drill |
Y |
Y |
|
|
Impedance
(single ended
& differential) |
± 10% |
± 7% |
|
|
Buried capacitance
(planar/discrete) |
Y |
Y |
|
|
Buried resistors |
N |
Y |
|
|
Chip cavity |
N |
Y |
|
|
Mixed dielectrics |
Y |
Y |
|
|
Conductive/non-conductive hole fill |
Y |
Y |
|
|
Metal core
(aluminum, copper) |
N |
Y |
|
|
Depth control drill/rout |
Y |
Y |
|
|
Etchback (plasma) |
Y |
Y |
|
|
|
|
|
|
**1: .002/.002 [50/50] achievable assuming improvements in LDI resolution (6000+ DPI).
**2: Assuming CAF resistant laminate.
**3: Minimum drill size is dependent on aspect ratio.
**4: Coretec Denver facility capability. Standard maximum board thickness is .250".
**5: Dependent on design.
**6: Denver and Cleveland only.
**7: Cleveland only.
Measurements in inches [millimeters].
|
