|
Standard Features
|
Standard Capabilities
|
Leading Edge
|
|
| I/L trace/space .5 oz copper |
.004/.004
|
.003/.003
|
|
| I/L trace/space 1 oz copper |
.005/.005
|
.004/.004
|
|
| I/L trace/space 2 oz copper |
.007/.007
|
.006/.006
|
|
| I/L trace/space 3 oz copper |
.009/.009
|
.008/.008
|
|
| Plated Layer trace/space .5 oz copper + plating |
.004/.005 |
.004/.004 |
|
| Plated Layer trace/space 1 oz copper + plating |
.006/.006 |
.005/.005 |
|
| Plated Layer trace/space 2 oz copper + plating |
.008/.008 |
.007/.007 |
|
|
Pad over drill size for tangency |
0.012 |
0.010
|
**4 |
|
Antipad over drill |
0.020
|
0.018
|
|
|
Minimum mechanical drill size |
0.010
|
0.008
|
**1 |
|
Minimum core thickness |
0.003
|
0.002 Non B/C
|
|
|
Maximum copper weight with UL approval |
3 oz
|
4 oz
|
|
|
Minimum copper weight |
1/2 oz
|
1/4 oz
|
|
|
Maximum aspect ratio |
10:1 |
12:1 |
|
|
Maximum layer count |
30+ |
30+ |
|
|
Maximum board thickness (due to equipment constraints) |
0.125 |
0.180 |
|
|
Minimum board thickness |
0.002 |
0.002 |
|
|
Solder mask registration - dry film |
± 0.010
|
± 0.008
|
|
|
Solder mask registration - liquid photo imageable |
± 0.0025
|
± 0.002
|
|
| |
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|
Micro via features |
|
|
|
|
Minimum micro via hole size |
0.004
|
0.003
|
|
|
Maximum aspect ratio |
.75:1 |
.9:1 |
|
|
Capture/target pad over drill size |
0.010
|
0.008
|
|
|
Glass reinforced dielectrics [UV/CO2 dual laser] |
Y |
Y |
**3 |
| |
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| |
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|
Materials |
|
|
|
|
FR-4 (130Tg & 180Tg) |
Y |
Y |
|
|
Nelco 4000-13 (enhanced multifunctional resin) |
Y |
Y |
|
|
Getek/Megatron (PPO) |
Y |
Y |
|
|
Polyimide |
Y |
Y |
|
| Rigid flex |
Y |
Y |
|
| Multilayer flex |
Y |
Y |
|
|
Rogers 4003 & 4350
(thermoset/ceramic/woven glass) |
Y |
Y |
|
|
Rogers 3203 (PTFE/ceramic) |
N |
Y |
|
|
Thermagon |
Y |
Y |
|
|
Speedboard C
|
N |
Y |
|
|
Thermount
|
N |
Y |
|
|
Bromine free |
N |
Y |
|
|
Taconics RF-35 (reinforced PTFE) |
N |
Y |
|
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|
Surface Finishes |
|
|
|
|
Hot air solder level |
Y |
Y |
|
|
Electroless nickel immersion gold |
Y |
Y |
**3 |
|
Electrolytic nickel/gold |
Y |
Y |
**3 |
|
Immersion tin |
Y |
Y |
**3 |
|
Immersion silver |
Y |
Y |
**3 |
|
Selective finishes |
N |
Y |
**2 |
|
Wire bondable soft electrolytic gold |
Y |
Y |
**3 |
|
Tin-lead reflow |
N |
Y |
**6 |
|
Organic solderability preservative |
Y |
Y |
**3 |
| |
|
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| |
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Other |
|
|
|
|
Buried core vias |
Y |
Y |
|
|
Sequential lamination |
Y |
Y |
|
|
Sculptured flex |
N |
Y |
|
|
Book binder rigid flex |
N |
Y |
**2 |
|
Optical drill |
N |
Y |
**3 |
|
Impedance (single ended & differential) |
± 10% |
± 7% |
**2 |
|
Chip cavity |
N |
Y |
|
|
Mixed dielectrics |
Y |
Y |
|
|
Conductive/non-conductive hole fill |
Y |
Y |
**2 |
|
Metal core
(aluminum, copper) |
N |
Y |
|
|
Depth control drill/rout |
Y |
Y |
|
|
Etchback (plasma) |
Y |
Y |
|
|
|
|
|
|
**1: .002/.002 [50/50] achievable assuming improvements in LDI resolution (6000+ DPI).
**2: Assuming CAF resistant laminate.
**3: Minimum drill size is dependent on aspect ratio.
**4: Coretec Denver facility capability. Standard maximum board thickness is .250".
**5: Dependent on design.
**6: Denver, and Cleveland only.
**7: Cleveland only.
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