Coretec Inc. - Design Group
Coretec’s award-winning Design Group team has expertise in the design of commercial as well as Military & Aerospace interconnects.  Coretec's Design Group is a key component of our "one-stop" strategy which emphasizes the provision of value added services to leading electronic interconnect developers and users.

The Design Group has a total solutions focus from mechanical guidance to the design of complex, high density, high reliability PCB's, optimized for the manufacturing, assembly and test domains.

Coretec’s Design Group is comprised of IPC certified designers (CID or CID+) who receive ongoing intensive education. The Design Group utilizes a world-class toolset, Mentor Expedition which has the ability to translate and output Mentor, Cadence, PADS and other design languages.

The Design Group has extensive experience in designing PCBs incorporating the following technologies:
 
  • High layer counts
  • Rigid flex 
  • Flex
  • High density interconnect (HDI) including both blind and buried vias
  • Microvia
  • Controlled impedance
  • Imbedded passives
  • Micro BGA
  • Backpanels
  • PCBCIA
  • Thermal management including heatsinks
  • EMI and EMC control
  • Stepped and cavity construction
  • Compact PCI
  • PMC
  • PCIe
  • DDR2 and newer memory

    Coretec's Design Group has completed thousands of designs for aerospace, telecom,
    automotive, medical and consumer product companies in Canada and the USA.

    References available upon request

    • MAP
    Design Group Brochure

    Design Links:
  • www.mentor.com
  • www.cadence.com
  • www.ipcdesignerscouncil.org

    Contact Info:
    If you are interested in Coretec Design Group's services we can be contacted at:
    General Manager
     Rich Buitendyk
     Kitchener, ON
     Canada, N2G 2P1
     Tel:519-489-2142
     Tel: 519-489-2140
     Cell: 519-580-5406
     rbuitendyk@coretec-inc.com
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